The accelerometers realized with MEMS technology (Micro-Electro-Mechanic System) are nothing more than miniaturized accelerometers based on a mobile micromechanical structure, realized by engraving a silicon substrate with standard photolithographic methods.
The main advantages of these devices are the low production cost (in particular for two or three measurement axes) and the presence inside them of the conditioning circuit for the response at low frequencies extended up to the continuous. A MEMS accelerometer provides accurate detection while measuring acceleration, tilt, shock, and vibration in the performance-driven application.
The negative aspects of this production technology have repercussions on performance in terms of accuracy and stability currently lower than the best piezoelectric accelerometers. Furthermore, the coating containers typically used for such devices (the Dual in-line packages for integrated circuits) are not suitable for industrial measurements in hostile environments.